Dicing Tape
Two types of dicing tape are available: UV curable type, “D series,” which achieves easier pick-up after reducing adhesion by UV irradiation, and non-UV type, “G series,” which features outstanding long-term stability.
D series
Adwill D series is an epoch-making line of UV curable dicing tapes whose features can be changed in accordance with operational process. The tape's strong adhesion secures wafers during dicing, and then is reduced by UV irradiation to facilitate pick-up. This dicing tape is essential for full-cut dicing of wafers to improve die quality, and fully applicable to dies of multiple sizes.
1. Secures wafers with strong initial adhesion to ensure dicing without any slipping or peeling even for small dies
2. Supports instant control of adhesion by UV irradiation, allowing large dies to be picked up easily
3. Causes no contamination by metal ions or by adhesive residue on the wafer backside surface, and no adverse UV irradiation effects on IC chips
4. We have a variety of products to meet customers' process and application.
5. Supports the adhesive coating process environment that meets Class 100 (ANSI 209b) standards
Product Information
| Type | Features | tape types |
| UV | Si Wafer Base Material: PVC, PO |
- High Expandability - Anti-chipping - Easy Pick Up - Antistatic - High Adhesion |
| Glass/Ceramics Base Material: PET, PO |
- Standard | |
| Package Substrate Base Material: PO |
- Standard - Antistatic |
|
| Full Cut Laser Dicing Base Material: Special |
- Standard | |
| Stealth Dicing Base Material: PVC, PO |
- Expand Singulation - Antistatic - Antistatic & Expand Sigulation & Through Tape Dicing |
|
| Wafer with LC Tape Base Material: PO |
- Standard | |
| Taiko Wafer Base Material: PVC, PO |
- Standard | |
| LED Process Base Material: PVC, PO |
- Standard |
G series
The Adwill G series is a line of removable dicing tapes. With this type of tape, adhesive strength remains stable after wafer mounting. Using a film with superb flexibility and expansion characteristics, the tape also has outstanding expandability. It can be used with dies of multiple sizes, and is outstanding in terms of cost performance. Moreover, it can be used in an adhesive coating process environment that meets Class 100 (ANSI 209b) standards, and can be readily applied in fabrication processes.
Product Information
| Type | Features | tape types |
| Non-UV | Si Wafer Base Material: PVC, PO |
- For Small Die - Antistatic - For Large Die Easy Pick Up - Excellent Visibility and Evenness |
| Full Cut Laser Dicing Base Material: Special |
- Standard | |
| LED Process Base Material: PVC, PO |
- Standard |