Tape
LINTEC Corporation is a leading Japanese manufacturer in the field of adhesives. We offer an extremely diverse range of UV and Non-UV Dicing, Back Grinding as well as Die Bonding and Backside Coating Tape.
LINTEC Corporation is a leading Japanese manufacturer in the field of adhesives. We offer an extremely diverse range of UV and Non-UV Dicing, Back Grinding as well as Die Bonding and Backside Coating Tape.
Our machine specs are constantly improved in order to match the latest demands from the semiconductor market. Our line-up includes Laminator and Peeler, Wafer Mounter as well as UV Irradiation System.