Dicing Die Bonding Tape

This tape has the functional combination of dicing tape and die-attach film. It solves problems such as bleeding of liquid adhesive. Products suitable for DBG(Dicing Before Grinding) process are also available.

LE Tape

Adwill LE Tape is a high value-added tape that combines the functions of dicing tape and die bonding material. Prevents adhesive bleeding or unevenness by transferring the adhesive uniformly onto the backside of the die at pick-up. Particularly suited for die bonding of thick stacked CSPs. Processing is also simplified since the same tape can be used in the process from dicing to bonding.

1. During dicing, the tape secures wafers in a manner similar to regular dicing tape. It is a multi-functional tape that transfers an adhesive layer to the backside when a die is picked up.

2. Because the DAF lamination process can be omitted, processing is simplified, while damage to the wafer caused by heat treatment during adhesion is eliminated as well.

3. Because heat curing (wafer mounting) can be done at low temperatures, the probability for damage to the wafer from heating is reduced.

4. There are no problems such as adhesive bleeding or die tilt.

5. Three lineups are available for following applications: one for die to die, one for die to substrate which conforms well to the bumps and depressions, and one for die to die FOW.* *FOW: Film On Wire

Product Information

Type Features tape types
Die to Substrate Cure - Cureless Adhesive Thickness 10µm - 30µm
Die to Die Cure - Cureless Adhesive Thickness 10µm - 25µm
Die to Die FOW Cure Adhesive Thickness 60µm - 75µm

LD Tape

Adwill LD Tape is dicing die bonding tape best suited for the DBG (Dicing Before Grinding) process. High quality adhesive layer cutting of “LD Tape” is achieved by using full cut laser dicing after applying dicing die bonding tape to separated dies in the DBG process.

1. Easy pick-up allows it to be effective for ultra-thin dies.

2. Available in adhesive thickness of 7µm, enabling high density and multi-stacked packages.

Product Information

Type Features tape types
for DBG Cure Adhesive Thickness 7µm