D-Series – LINTEC Munich

UV Curable Dicing Tape

Adwill D-Series is an epoch-making line of UV curable dicing tapes whose features can be changed in accordance with operational processes. The tape’s strong adhesion secures wafers during dicing and is then reduced by UV irradiation to facilitate pick-up. D-Series tape is essential for high quality wafer dicing and is fully applicable to dies of multiple sizes.

Advantages

Secures wafers with strong initial adhesion to ensure dicing without any slipping or peeling – even for small dies

Supports instant control of adhesion by UV irradition, allowing even large dies to be picked up easily

Causes no contamination by metal ions or by adhesive residue on the wafer backside surface, and no adverse UV irradiation effects on IC chips

We have a variety of products to meet customers’ process and application

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