P-Series

Non-UV Curable Back-Grinding Tape

Adwill P-Series of non-UV curable back-grinding tapes fully protects the wafer surface during grinding and prevents wafer surface contamination from infiltration of grinding fluid and/or debris.

P-Series tapes perform with virtually no residual adhesive after the tape is peeled off, while its highly precise tape thickness accuracy ensures uniform wafer thickness after back–grinding.