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E series （UV Curable BG Tape）

E-Series

UV Curable Back-Grinding Tape

The Adwill E-Series of UV curable Back Grinding Tape prevents damage to the wafer surface during back-grinding and contamination caused by grinding fluid and/or debris. The adhesion of E-Series back-grinding tapes is substantially decreased by UV irradiation after grinding, allowing for easy peeling without stress to the wafer. This feature makes this series highly suitable for the processing of thin wafers.

Standard Type (General-use)
As contamination of the wafer surface is basically eliminated, the wafer does not require cleaning after back grinding. The adhesive coating environment exceeds class 100 (US Federal Standard 209b).

Tape Types for Thin, Bump Wafers
The inherent stress relaxation capability of this tape, curtails wafer bow that would otherwise arise after back grinding due to residual stress during tape lamination. Moreover, by dispersing stress during back grinding of bump wafers, this tape prevents wafer damage and wafer dimples, while enhancing wafer thickness accuracy. High precision tape thickness accuracy ensures precision wafer thickness after back grinding.

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