RAD-2512F/12

Fully-Automatic Vacuum Mounter. High-precision vacuum mounting & non-contact handling

 
High-precision vacuum mounting
Achieves precise mounting of uniquely shaped wafers.

Non-contact wafer handling
Prevents contact with sensitive surfaces or metalizations and is ideally suited for TAIKO® or MEMS wafers.

Advanced inline pre-cut system
Minimizes waste of material, decreases production cost and reduces tape pitch from 10mm to 2mm.

Wide variety of optional functions
RAD-2512F/12 can be equipped with various optional functions, for example wafer-ID reading or OHT-capability.

Options
  • Handling of 150mm or 300mm wafers
  • Inline pre-cut unit
  • Warped wafer support system
  • Camera alignment system
  • Wafer-ID reading function
  • Double loader and unloader specification
  • Host communication function (SECS/GEM)
  • OHT capability
  • High-class ESD countermeasure specification: ±50V or less immediately after the end of operation (reference value, measured on mirror wafer)

Product Video
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