RAD-2510F/8

Fully-Automatic Wafer Mounter. Perfectly suited for SiC & GaN.

 
High-speed operation
Operates at high speed with a capacity of 120 wafers/hour and includes an improved attachment table heating function.

Supports warped wafer handling
The non-contact alignment system enables the handling of 200 mm wafers with up to 5mm warpage.

Built-in vision system
Optionally, the machine can incorporate an integrated vision system to facilitate closed-loop process control (wafer ID reader & barcode attachment system).

Small foot print
Compact design to save valuable cleanroom space.

Options
  • Full-contact wafer mounting table
  • Wafer & mounting table cleaning-function
  • Double loader & unloader specification
  • Dicing tape inline pre-cut unit
  • Attachment table heater specification
  • Vision system (wafer ID reader & barcode attachment system)
  • Host communication function (SECS/GEM)
  • ESD compatibility

Product Video
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