RAD-2500m/8

Semi-Automatic Wafer Mounter for 8 inch, 6 inch, 5 inch and 4 inch wafers. Suited for low & medium volume production or R&D environments.

Uses pre-cut tape

LINTEC’s semi-automatic dicing tape mounters enable easy operation by the use of pre-cut tapes. By simply placing a wafer and frame on the equipment’s table, dicing tape mounting is automatically performed.

Ensured safety & easy to operate

Extremely safe handling, a user-friendly interface and increased operational effciency as the equipment uses no cutting blade.

Accurate & reliable mounting

LINTEC’s patented Tape Tension Control system (TTC) enables reliable tape mounting through prevention of air voids and application of controlled and individually adjustable tape tension. *TTC (Tape Tension Control) System : The TTC is a cutting-edge system, in which a microcomputer controls tape tension. It enables the tape to be laminated according to the tape type and back-end processing conditions. On the fully-automatic type, tape application torque and torque curve can be set and registered with the equipment’s touch screen.

Small footprint & high performance

Achieving highest quality mounting results, LINTEC’s semi-automatic mounters accommodate the demand for a compact equipment with reliable performance and effective use of workspace.

Options

Non-contact wafer-tables, as well as manifold other table-design options
Wafer-table heating function, up to 100°C
Optical & mechanical sensors to detect pre-cut tape sheets & ensure repeatable mounting quality
Upright and customized tape-mounting system for thick & stiff PET tapes
CE compliance
Inline pre-cut unit for processing of roll-type tape
Ionizers to enhance anti-ESD performance