RAD-3020F/12

Fully-Automatic BG Tape Peeler. Ideal for non-contact handling & perfect for TAIKO®wafers & MEMS.

 
Non-contact BG tape peeling
LINTEC’s non-contact vacuum wafer table securely holds the wafer during peeling, touching it only on the edge-exclusion area.

Non-contact wafer handling
Prevents contact with sensitive surfaces or metalizations and is ideally suited for TAIKO® or MEMS wafers.

Warpage-correction unit
Optionally, this feature supports handling of thin and warped wafers.

Unique peeling method
Minimizes wafer stress and even enables non-contact peeling of ultra-thin wafers and TAIKO® membranes.

Options
  • Handling of 150mm wafers
  • Warped wafer handling specification
  • Multi-functional handy barcode-reader
  • Host Communication function (SECS/GEM)
  • OHT capability
  • ULPA filter clean-air spec

Product Video
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