RAD-3010F/12

Fully-Automatic BG Tape Peeler. Minimal stress BG tape peeling technology.

 
180-degree peeling technique
Maintaining an ideal peeling-angle of 180 degrees during delamination of the BG tape minimizes stress on fragile and thin wafers.

Prevents wafer circuit damage
By thermocompression-bonding a heat-seal peeling-tape to the BG tape within 3mm of the wafer’s periphery, the risk of damage to the wafer surface is reduced to an absolute minimum.

Closed-loop UV-illuminance control
A built-in control-sensor guarantees constant UV-illuminance. The selection of an individually programmable irradiation-speed within a defined recipe ensures stable UV conditions to achieve flawless peeling results.

Options
  • Handling of 150mm wafers
  • Double load port for FOUP / FOSB or cassette
  • Additional ionizer specification
  • HEPA filter clean-air spec
  • Warped wafer handling specification
  • Multi-functional handy barcode-reader
  • Host communication function (SECS/GEM)
  • OHT capability
  • Wafer table cleaning function

Product Video
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