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RAD-3520F/12

RAD-3520F/12

Fully-Automatic BG Tape Laminator. High-precision BG tape cutting & lamination.

 
Use of a multi-joint robotic arm
The multi-joint robotic arm offers versatile capabilities, allowing users to change the cutting angle & perform over, negative, and V-notch (optional) cutting with precision.

High throughput
Standard specification: Maximum UPH: 70

High speed specification (optional): Maximum UPH: 100 (Capacity based on following conditions: Wafer: 300 mm mirror polished wafer; Non-UV curable back-grinding tape: P-4140A from LINTEC).

Small foot print
1,245mm (W) x 1,850mm (D) x 1,920mm (H)

A wide variety of optional functions
RAD-3520F/12 can be equipped with a wide range of optional functions to match specific customer requirements.

Options
  • High speed specification
  • Automatic tape cutter exchange function
  • Wafer table & tape cutter cleaning function
  • Host communication function (SECS/GEM)
  • Wafer ID reader
  • ESD countermeasure specifications
  • Warped wafer handling specification

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