LINTEC Tape Novelties
Heat-Resistant Tape
Problem in High-Temperature Processes
Standard UV dicing tapes can lose chemical and mechanical stability when exposed to temperatures above 150°C. This can make post-dicing processes difficult and may damage your devices.
LINTEC's Solution
LINTEC’s high-temperature-resistant dicing tapes remain stable even under extreme temperature, substituting the need to use heat-resistant carrier tapes and time-consuming remounting- or tape-transfer processes.
Anti-ESD DC-Tape
ESD Risk in Chip Manufacturing
Electrostatic discharge (ESD) can permanently damage sensitive semiconductor devices during manufacturing. Various types of applications are highly vulnerable to ESD, including RF devices, image sensors, and display driver ICs.
LINTEC's Anti-ESD Protection
LINTEC’s Anti-ESD dicing tapes safely dissipate static electricity during wafer processing. They protect your applications from damage, help to reduce particle attraction through anti‑static properties, and increase overall device reliability.
Thermal Conductive LC-Tape
Heat Management Challenge
Modern power devices generate substantial thermal loads during operation. Without effective thermal management, device performance, reliability, and operational lifetime can be significantly reduced.
LINTEC's Advanced Thermal Solution
LINTEC’s thermal conductive backside coating tape features a highly heat-conductive core that efficiently transfers temperature away from the die. This improves thermal performance, supports reliable operation, and integrates easily into high-volume semiconductor manufacturing processes.