LINTEC Tape Novelties
Heat-Resistant Tape
Problem in High-Temperature Processes
Standard UV dicing tapes can lose stability when exposed to temperatures above 150°C. This can make tape removal difficult and may damage chips or contaminate sensitive surfaces.
LINTEC’s Solution
LINTEC’s high-temperature-resistant dicing tapes remain stable even under extreme heat. They ensure clean tape removal, protect semiconductor surfaces, and help improve production yield.
Anti-ESD DC-Tape
ESD Risk in Chip Manufacturing
Electrostatic discharge (ESD) can permanently damage sensitive semiconductor devices during manufacturing. Many chips are highly vulnerable, including RF devices, image sensors, and display driver ICs
LINTEC’s Anti-ESD Protection
LINTEC’s Anti-ESD dicing tapes safely dissipate static electricity during wafer processing. They protect wafers and dies from damage, reduce particle contamination, and help improve yield and device reliability.
Thermal Conductive LC-Tape
Heat Management Challenge
Modern power devices generate significant heat during operation. Without effective heat management, performance, reliability, and lifetime can be reduced.
LINTEC’s Advanced Thermal Solution
LINTEC’s backside coating tape features a highly thermally conductive core that efficiently transfers heat away from the die. This improves thermal performance, supports reliable operation, and integrates easily into high-volume semiconductor manufacturing processes.