Back-Grinding Tape: LINTEC Munich Solutions for High-Yield Semiconductor Wafer Thinning
In the fast-evolving semiconductor industry back-grinding tape has become a mission-critical consumable in wafer thinning processes. As chip architectures become
In the fast-evolving semiconductor industry back-grinding tape has become a mission-critical consumable in wafer thinning processes. As chip architectures become
A few days ago, we had a different kind of photoshoot. Instead of models, our semi-automatic machines and tapes were
LINTEC has developed Pattern Coating Before Lamination (PCBL), a process for the back grinding of semiconductor wafers that reduces thickness
It was a great pleasure to have the opportunity to introduce LINTEC’s Tape x Equipment solutions to Minister Aiwanger. Bavaria
From November 18-21, we’ll be on site and look forward to engaging conversations with partners, customers, and industry peers.
This week, we created a special “catwalk” for our machines.
Invest in Bavaria took the time to interview our Managing Director, Christian Sabold.
Great news! LINTEC has received certification from the Science Based Targets initiative (SBTi) for its greenhouse gas (GHG) reduction targets.
This week, we had the great honor of welcoming distinguished guests from our corporate headquarters in Japan: Mr. Makoto Hattori,
This marks an exciting step forward as we look to strengthen collaboration with leading players in the power electronics ecosystem.