lintece-logo
LC Tape

LC-Series

Backside Coating Tape

Adwill LC Tape was developed to protect and reinforce the die backside in applications such as Flip Chip, in which the die is mounted onto a substrate from the circuit surface. While protecting and reinforcing the die backside, it also blocks light to minimize effects on the circuit surface. Unlike a coating of liquid mold material, this product is available as a tape, ensuring outstanding uniformity in thickness, and allowing the simplification of conventional processes.

Lamination can take place at relatively low temperatures so that the risk of circuit damage from heat is reduced. Featuring both high quality and stability, the tape has passed reliability tests in environments of high temperature and humidity.

This tape can be used with LINTECS’s high performance laminator (RAD-3600F/12) for tape lamination, which in turn contributes to the structuring of highly reliable production lines. The tape is laminated to the die backside before dicing, which helps prevent wafer chipping during dicing. Laser markings such as the manufacturer’s name or lot number can be inscribed on the tape’s backside.
Product Brochure
Product PDF
Send email