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		<loc>https://www.linteceurope.com/shop/equipment/uv-irradiation-system/rad-2020f-12/</loc>
		<video:video>
			<video:title><![CDATA[RAD-2020F/12 - LINTEC Munich]]></video:title>
			<video:publication_date>2025-02-28T13:56:48+00:00</video:publication_date>
			<video:description><![CDATA[Fully-Automatic UV-LED Irradiation System. With a selectable light source &amp; reduced energy consumption.   Selectable UV-light source RAD-2020F/12 can either be equipped with a high-pressure mercury lamp or a UV-LED system. Note: the high-pressure mercury lamp machine version can be retrofitted with a UV-LED system later on. Improvement of UPH (+20%) UPH improvement of 20% compared to LINTEC’s predecessor model by using electrified drive-shafts, as well as an optimized design-concept &amp; process flow. Maximum UPH: 110 wafers / h (300mm wafer, UV irradiation speed 90mm/sec.). Reduced footprint 1,590mm (W) x 1,200mm (D) x 1,800mm (H) Reduced energy consumption Reduction of energy consumption by up to 95% with UV-LED and by up to 38% with high pressure mercury lamp. Options Workpiece temperature measurement after UV irradiation Automatic temperature-control system in the lamp house for the high-pressure mercury lamp machine version Double cassette loader or double load-port OHT capability High-class ESD countermeasure specification: ±50V or less immediately after the end of operation (Reference value, measured on mirror wafer)]]></video:description>
			<video:thumbnail_loc>https://www.linteceurope.com/wp-content/uploads/2025/02/RAD-2020F12.jpg</video:thumbnail_loc>
			<video:content_loc>https://www.linteceurope.com/wp-content/uploads/2025/02/RAD-2020F_12-2-1.mp4</video:content_loc>
			<video:family_friendly>yes</video:family_friendly>
			<video:uploader info="https://www.linteceurope.com/author/adm_lintec/">adm_lintec</video:uploader>
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	<url>
		<loc>https://www.linteceurope.com/shop/equipment/wafer-mounter/rad-2512f-12-fully-automatic-vacuum-mounter/</loc>
		<video:video>
			<video:title><![CDATA[RAD-2512F/12 - LINTEC Munich]]></video:title>
			<video:publication_date>2025-02-05T19:15:37+00:00</video:publication_date>
			<video:description><![CDATA[Fully-Automatic Vacuum Mounter. High-precision vacuum mounting &amp; non-contact handling   High-precision vacuum mounting Achieves precise mounting of uniquely shaped wafers. Non-contact wafer handling Prevents contact with sensitive surfaces or metalizations and is ideally suited for TAIKO® or MEMS wafers. Advanced inline pre-cut system Minimizes waste of material, decreases production cost and reduces tape pitch from 10mm to 2mm. Wide variety of optional functions RAD-2512F/12 can be equipped with various optional functions, for example wafer-ID reading or OHT-capability. Options Handling of 150mm or 300mm wafers Inline pre-cut unit Warped wafer support system Camera alignment system Wafer-ID reading function Double loader and unloader specification Host communication function (SECS/GEM) OHT capability High-class ESD countermeasure specification: ±50V or less immediately after the end of operation (reference value, measured on mirror wafer)]]></video:description>
			<video:thumbnail_loc>https://www.linteceurope.com/wp-content/uploads/2025/02/2512F12-scaled.jpg</video:thumbnail_loc>
			<video:content_loc>https://test.linteceurope.com/wp-content/uploads/2025/07/RAD-2512F_12.mp4</video:content_loc>
			<video:family_friendly>yes</video:family_friendly>
			<video:uploader info="https://www.linteceurope.com/author/adm_lintec/">adm_lintec</video:uploader>
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	<url>
		<loc>https://www.linteceurope.com/shop/equipment/wafer-mounter/rad-2510f-8-200mm-fully-automatic-wafer-mounter/</loc>
		<video:video>
			<video:title><![CDATA[RAD-2510F/8 - LINTEC Munich]]></video:title>
			<video:publication_date>2025-02-05T19:09:45+00:00</video:publication_date>
			<video:description><![CDATA[Fully-Automatic Wafer Mounter. Perfectly suited for SiC &amp; GaN.   High-speed operation Operates at high speed with a capacity of 120 wafers/hour and includes an improved attachment table heating function. Supports warped wafer handling The non-contact alignment system enables the handling of 200 mm wafers with up to 5mm warpage. Built-in vision system Optionally, the machine can incorporate an integrated vision system to facilitate closed-loop process control (wafer ID reader &amp; barcode attachment system). Small foot print Compact design to save valuable cleanroom space. Options Full-contact wafer mounting table Wafer &amp; mounting table cleaning-function Double loader &amp; unloader specification Dicing tape inline pre-cut unit Attachment table heater specification Vision system (wafer ID reader &amp; barcode attachment system) Host communication function (SECS/GEM) ESD compatibility]]></video:description>
			<video:thumbnail_loc>https://www.linteceurope.com/wp-content/uploads/2025/02/2510F8-scaled.jpg</video:thumbnail_loc>
			<video:content_loc>https://test.linteceurope.com/wp-content/uploads/2025/05/AI-video-RAD-2510F_8.mp4</video:content_loc>
			<video:family_friendly>yes</video:family_friendly>
			<video:uploader info="https://www.linteceurope.com/author/adm_lintec/">adm_lintec</video:uploader>
		</video:video>
	</url>
	<url>
		<loc>https://www.linteceurope.com/shop/equipment/peeler/rad-3020f-12-300mm-fully-automatic-bg-tape-peeler/</loc>
		<video:video>
			<video:title><![CDATA[RAD-3020F/12 - LINTEC Munich]]></video:title>
			<video:publication_date>2025-02-05T18:59:38+00:00</video:publication_date>
			<video:description><![CDATA[Fully-Automatic BG Tape Peeler. Ideal for non-contact handling &amp; perfect for TAIKO®wafers &amp; MEMS.   Non-contact BG tape peeling LINTEC’s non-contact vacuum wafer table securely holds the wafer during peeling, touching it only on the edge-exclusion area. Non-contact wafer handling Prevents contact with sensitive surfaces or metalizations and is ideally suited for TAIKO® or MEMS wafers. Warpage-correction unit Optionally, this feature supports handling of thin and warped wafers. Unique peeling method Minimizes wafer stress and even enables non-contact peeling of ultra-thin wafers and TAIKO® membranes. Options Handling of 150mm wafers Warped wafer handling specification Multi-functional handy barcode-reader Host Communication function (SECS/GEM) OHT capability ULPA filter clean-air spec]]></video:description>
			<video:thumbnail_loc>https://www.linteceurope.com/wp-content/uploads/2025/02/3020F12-scaled.jpg</video:thumbnail_loc>
			<video:content_loc>https://www.linteceurope.com/wp-content/uploads/2025/02/LINTEC-RAD-3020F_12-Subs-2.mp4</video:content_loc>
			<video:family_friendly>yes</video:family_friendly>
			<video:uploader info="https://www.linteceurope.com/author/adm_lintec/">adm_lintec</video:uploader>
		</video:video>
	</url>
	<url>
		<loc>https://www.linteceurope.com/shop/equipment/peeler/rad-3010f-12-300mm-fully-automatic-bg-tape-remover/</loc>
		<video:video>
			<video:title><![CDATA[RAD-3010F/12 - LINTEC Munich]]></video:title>
			<video:publication_date>2025-02-05T18:56:41+00:00</video:publication_date>
			<video:description><![CDATA[Fully-Automatic BG Tape Peeler. Minimal stress BG tape peeling technology.   180-degree peeling technique Maintaining an ideal peeling-angle of 180 degrees during delamination of the BG tape minimizes stress on fragile and thin wafers. Prevents wafer circuit damage By thermocompression-bonding a heat-seal peeling-tape to the BG tape within 3mm of the wafer’s periphery, the risk of damage to the wafer surface is reduced to an absolute minimum. Closed-loop UV-illuminance control A built-in control-sensor guarantees constant UV-illuminance. The selection of an individually programmable irradiation-speed within a defined recipe ensures stable UV conditions to achieve flawless peeling results. Options Handling of 150mm wafers Double load port for FOUP / FOSB or cassette Additional ionizer specification HEPA filter clean-air spec Warped wafer handling specification Multi-functional handy barcode-reader Host communication function (SECS/GEM) OHT capability Wafer table cleaning function]]></video:description>
			<video:thumbnail_loc>https://www.linteceurope.com/wp-content/uploads/2025/02/3010F12-scaled.jpg</video:thumbnail_loc>
			<video:content_loc>https://www.linteceurope.com/wp-content/uploads/2025/02/RAD-3010F_12-video.mp4</video:content_loc>
			<video:family_friendly>yes</video:family_friendly>
			<video:uploader info="https://www.linteceurope.com/author/adm_lintec/">adm_lintec</video:uploader>
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	<url>
		<loc>https://www.linteceurope.com/shop/equipment/laminator/rad-3520f-12-300mm-fully-automatic-bg-tape-laminator/</loc>
		<video:video>
			<video:title><![CDATA[RAD-3520F/12 - LINTEC Munich]]></video:title>
			<video:publication_date>2025-02-05T18:40:13+00:00</video:publication_date>
			<video:description><![CDATA[Fully-Automatic BG Tape Laminator. High-precision BG tape cutting &amp; lamination.   Use of a multi-joint robotic arm The multi-joint robotic arm offers versatile capabilities, allowing users to change the cutting angle &amp; perform over, negative, and V-notch (optional) cutting with precision. High throughput Standard specification: Maximum UPH: 70 High speed specification (optional): Maximum UPH: 100 (Capacity based on following conditions: Wafer: 300 mm mirror polished wafer; Non-UV curable back-grinding tape: P-4140A from LINTEC). Small foot print 1,245mm (W) x 1,850mm (D) x 1,920mm (H) A wide variety of optional functions RAD-3520F/12 can be equipped with a wide range of optional functions to match specific customer requirements. Options High speed specification Automatic tape cutter exchange function Wafer table &amp; tape cutter cleaning function Host communication function (SECS/GEM) Wafer ID reader ESD countermeasure specifications Warped wafer handling specification]]></video:description>
			<video:thumbnail_loc>https://www.linteceurope.com/wp-content/uploads/2025/02/3520F12-scaled.jpg</video:thumbnail_loc>
			<video:content_loc>https://www.linteceurope.com/wp-content/uploads/2025/02/LINTEC-RAD-3520F_12.mp4</video:content_loc>
			<video:family_friendly>yes</video:family_friendly>
			<video:uploader info="https://www.linteceurope.com/author/adm_lintec/">adm_lintec</video:uploader>
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